Towards reliable smart textiles: Investigating thermal characterisation of embedded electronics in E-Textiles using infrared thermography and mathematical modelling

The smart textiles field, which includes e-textiles, has seen rapid development in recent years due to its wide market applications such as wearables, architecture, energy and product design. Electronic circuits of e-textiles involve devices LEDs, sensors batteries that are embedded within the yarns. Since temperature is a crucial element causing profound problems electronic when it exceeds certain threshold, extensive research efforts have be done reduce negative effect enhance sustainability devices. In this work, infrared thermographic imaging technology utilised experimentally study thermal distribution profile LEDs their bare, encapsulated state e-yarns manufacturing stages. experimental results compared with numerical analysis models carried out solving time-dependent partial differential equations heat transfer process. camera 320 × 240 pixel vanadium oxide microbolometer detects differences less than 0.1 °K special micro close-up lens take images LED samples. Additionally point-measurement technique, using thermocouple, ensure accurate measurements recorded for calibration. work prove thermography suitable can provide significant information about behaviour textiles. It been found integrated Gaussian-like shape. This bell-shaped gets higher wider by adding an additional device circuit specific distance range. case multiple between them plays role determining overall system shaping final distribution, hence reliability textile on long term. also show cover yarn influence dissipation Consequently, selection yarn’s material structure could critical factor performance e-textiles.